惠州LNP THERMOCOMP Lexan_SML5897
应用范围： 产品描述 LNP THERMOCOMP Lexan_SML5897物性表 LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
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产品描述
惠州LNP THERMOCOMP Lexan_SML5897物性表
LNP* Thermocomp* Lexan_SML5897 compound is a 40% carbon fiber reinforced PC for use in high modulus applications.
来源：http://hz.va-so.com/product827950.html
发布时间：2022/5/9 12:04:39
