惠州LNP THERMOCOMP EC006PXQ

应用范围：　　产品描述　　LNP THERMOCOMP EC006PXQ物性表　　30%碳纤维增强材料，LNP THERMOCOMP EC006PXQ is a compound based on Polyetherimide containing 30% Carbon FIber. Added features include: Electrically Conductive, Easy Molding.

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　　产品描述

　　惠州LNP THERMOCOMP EC006PXQ物性表

　　30%碳纤维增强材料，惠州LNP THERMOCOMP EC006PXQ is a compound based on Polyetherimide containing 30% Carbon FIber. Added features include: Electrically Conductive, Easy Molding.